OVATM Power Chip ELO-BCRExxx-x

LED Chip Diagram:




Features:
Growth Technique MOCVD
Substrate Sapphire (0001)
Structure InGaN MQW
Chip size 1000±30μm x 1000 ±30μm
Wafer thickness 150± 5 μm
Testing & sorting 100 %
Packaging 20cm±5mm x 20 cm±5mm
(blue tape medium tack)
Backside reflector Al metal

Mechanical Dimensions :

Au Pad thickness 1.6±0.2 μm
Au Pad diameter P: 110 μ m / N: 120 μm

Optical and Electrical characteristics
Ta=25C°, If=350mA -ELO-BCREBLU-M
Bin Number
Blue Brightness"-X mW"3
Dominant
Wavelength(nm)
Vf (V)
-1
-2
-3
-4
-5
-6
Min
Max
Typ
Max
ELO-BCRE455-X
-
60~80
80~100
100~120
120~140
140~
455
460
3.7
4.0
ELO-BCRE460-X
-
60~80
80~100
100~120
120~140
140~
460
465
3.7
4.0
ELO-BCRE465-X
-
60~80
80~100
100~120
120~140
140~
465
470
3.7
4.0
ELO-BCRE470-X
-
60~80
80~100
100~120
120~140
140~
470
475
3.7
4.0

Ta=25C°_If=350mA - ELO-BCREGRN-M
Bin Number
Green Brightness"-X mW"3
Dominant
Wavelength(nm)
Vf (V)
-1
-2
-3
-4
-5
-6
Min
Max
Typ
Max
ELO-BCRE515-X
-
30~50
50~
-
-
-
515
520
3.7
4.0
ELO-BCRE520-X
-
30~50
50~
-
-
-
520
525
3.7
4.0
ELO-BCRE525-X
-
30~50
50~
-
-
-
525
530
3.7
4.0
ELO-BCRE530-X
-
30~50
50~
-
-
-
530
535
3.7
4.0

LED chips are sorted to the brightness, dominant wavelength bins shown above. A blue tape will contain die from only one bin. Customer order for part numbers ELO-BCREBLU-M and ELO-BCREGRN-M may consist of dies from multiple blue tapes with any or all bins (ELO-BCRE4XX-X), and (ELO-BCRE5XX-X) respectively.
Fig. 1 Forward Current vs. Forward Voltage
Fig. 2 Relative Luminous Intensity vs. Forward Current
(Device is tested under a probe station)

Fig. 1 Forward Current vs. Forward Voltage


Fig. 2 Relative Luminous Intensity vs. Forward Current
(Device is tested under a probe station)


Absolute maximum ratings:
Parameter Symbol Unit Condition Rating
Forward DC Current If mA Ta=25oC, Rja <60oC/W 400(*)
Reverse voltage Vr V Ta=25oC, Ir = 10μA -5V
Junction Temperature Tj oC   125
Reverse Current Ir μA Vr = -5 V <10
Assembly Process Temperature   oC   250oC(<5 sec)

(*) maximum driving current depends on operating temperature and thermal
resistance of package

Fig. 3 Maximum derating forward DC current vs. Ambient Temperature.
Derating based on Tj(max)=125°C



Remarks
1. eLite’s GaN LEDs are Class 1 ESD sensitive.
2. Contact eLite for assistance in improving the light extraction efficiency of your package.
3. Brightness values are measured using Au plated TO39 headers without an encapsulant.

 

 
   
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